504 products in Components

- Open style delivers better performance on cooling, compatibility and maintenance - Suitable for: itx motherboard 17*17cm（6.69*6.69inch） - item size:19.7cm*19.4cm(7.75*7.63inch) - PCL column, itx specification, with two PCI metal column - package include:1*acrylic board,2*PCI Column,1*some screws,4*bottom pads

- Adherence to JEDEC and compliance to RoHS with respect to environmental protection regulation, production and manufacturing - All new generation product of DRAM module. Strict test and verification procedures are performed for products - Lifetime warranty and Free technical support - Installation video is attached in product image

Size: 8GB

- Adherence to JEDEC and compliance to RoHS with respect to environmental protection regulation, production and manufacturing - All new generation product of DRAM module. Strict test and verification procedures are performed for products - Lifetime warranty and Free technical support - Installation video is attached in product image

Size: 16GB

- 0649528933980 - MTFDDAK3T8TGB-1BC1ZABYYR

- Memory Speed:16 Gbps - Low Profile Ready with Bracket Included - Chipset: AMD RX 6400 - Boost Clock: Up To 2321MHz - Memory: 4GB GDDR6

- Chipset: AMD RX 7900 XT - Memory: 20GB GDDR6 - XFX MERC Triple Fan Cooling Solution - Boost Clock: Up to 2535 MHz

- Micron 5300 MAX Series MTFDDAK3T8TDT1AW1ZABYY 3.84TB 2.5 inch NonSED SATA3 Solid State Drive (3D TLC)

- Fully Modular: Only connect the cables your system needs, making clean and tidy builds easier. - 135mm Magnetic Levitation Fan: Utilizes a magnetic levitation bearing and custom engineered rotors for high performance, low noise, and superior reliability. - EPS12V Connector: For wide compatibility with modern graphics cards and motherboards. - 100% All Japanese 105°C Capacitors: Premium internal components ensure unwavering power delivery and long-term reliability. - Modern Standby Compatible: Extremely fast wake-from-sleep times and better low-load efficiency. - 80 PLUS Gold Certified: High efficiency operation for lower power consumption, less noise, and cooler temperatures.

Style: RMx (2021)    Size: 850W

- Flare X5 Series, with Dual OC Profile Support (AMD EXPO for AMD 600/800 Series Chipset with Ryzen 7000/8000G/9000 Series CPU; and Intel XMP 3.0 for Intel 600/700/800 Series Chipset with 12th/13th/14th Gen Intel Core Series CPU or Intel Core Ultra 200 Series CPU) - Brand: G.Skill, Series: Flare X5 Model: F5-6000J3636F16GX2-FX5 - 32GB kit containing 2 x 16GB modules, DDR5-6000, 288-Pin, CAS Latency CL36 (36-36-36-96) at 1.35V (AMD EXPO & Intel XMP 3.0) - ECC: No, Dual Channel Kit, Recommended Use: High Performance Overclocking and Gaming Memory - Dual OC Profile support (Intel XMP 3.0 & AMD EXPO) to reach up to the rated overclock speed, or run at default JEDEC profile speed. Memory kits may boot to the SPD speed with default BIOS settings with compatible hardware. For memory kits with Intel XMP/AMD EXPO, enable XMP/EXPO profile in BIOS to reach the rated potential XMP/EXPO overclock speed of the memory kit, subject to the use of compatible hardware. Reaching the rated XMP/EXPO overclock speed and system stability will depend on the compatibility and capability of the motherboard and CPU used. - Check G.Skill QVL or RAM Configurator on the G.Skill website for validated motherboards. Motherboards not listed may not be capable of the performance profile or rated specifications. - Do not mix memory kits. Memory kits are sold in matched kits that are designed to run together as a set. Mixing memory kits will result in stability issues or system failure. Usage in any manner inconsistent with manufacturer specifications, warnings, designs, or recommendations will result lower speeds, system instability, or damage to the system or its components.

Style: DDR5-6000 36-36-36-96    Color: Black

- Flare X5 Series, designed for AMD 600/800 series chipset with AMD Ryzen 7000/8000G/9000 series CPU - Brand: G.Skill, Series: Flare X5, Model: F5-6000J3040G32GX2-FX5 - 64GB kit containing 2 x 32GB modules, DDR5-6000, 288-Pin, CAS Latency CL30 (30-40-40-96) at 1.40V (AMD EXPO) - ECC: No, Dual Channel Kit, Recommended Use: High Performance Overclocking and Gaming Memory - Memory kits will boot at the SPD speed at default BIOS settings with compatible hardware. - For memory kits with EXPO, enable EXPO profile in BIOS to reach the rated potential EXPO overclock speed of the memory kit, subject to the use of compatible hardware. - G.Skill QVL Certified Motherboards: https://www.gskill.com/qvl/165/396/1691400033/F5-6000J3040G32GX2-FX5-QVL - Do not mix memory kits. Memory kits are sold in matched kits that are designed to run together as a set. Mixing memory kits will result in stability issues or system failure.

- Flare X5 Series, designed for AMD 600/800 Series Chipset with Ryzen 7000/8000G/9000 Series CPU - Brand: G.Skill, Series: Flare X5 Model: F5-5600J3636C16GX2-FX5 - 32GB kit containing 2 x 16GB modules, DDR5-5600, 288-Pin, CAS Latency CL36 (36-36-36-89) at 1.20V (AMD EXPO) - ECC: No, Dual Channel Kit, Recommended Use: High Performance Overclocking and Gaming Memory - Memory kits will boot at the SPD speed at default BIOS settings with compatible hardware. - For memory kits with EXPO, enable EXPO profile in BIOS to reach the rated potential EXPO overclock speed of the memory kit, subject to the use of compatible hardware. - Reaching the rated EXPO overclock speed and system stability will depend on the compatibility and capability of the motherboard and CPU used. - G.Skill Specifications Page: https://www.gskill.com/specification/165/396/1662622737/F5-5600J3636C16GX2-FX5-Specification - Do not mix memory kits. Memory kits are sold in matched kits that are designed to run together as a set. Mixing memory kits will result in stability issues or system failure.

Style: DDR5-5600 36-36-36-89    Color: Matte Black

- AMD EXPO Certified - Improved stability for overclocking - Plug N Play - Low-profile heat spreader design

Style: Black    Size: 5600MT/s