- Gen5 Storage Performance: The PCIe 5.0 x4 controller delivers up to 10,000MB/sec sequential reads and up to 8,500MB/sec sequential write speeds*, for phenomenal read, write, and response times *Performance and endurance vary by capacity - Your PC Made Faster: Load games, boot Windows, open and transfer files, all faster than ever - High-Density 3D TLC NAND: Provides the ideal mix of performance and endurance to keep your drive performing at its best for years - Microsoft DirectStorage Support**: Enables the MP700 ELITE to communicate directly with your graphics card when playing compatible games, for unbelievably fast load times **DirectStorage requires a DirectX12 GPU with Shader Model 6.0 support - Performance Heatsink: A pre-installed aluminum heatsink ensures optimal operating temperatures and reduces performance throttling
Style: With Heatspreader
- Chipset: AMD RX 9070 - Memory: 16 GB GDDR6 - XFX QICK Triple Fan Cooling Solution - Boost Clock Up to 2700 MHz
Style: RX 9070 QICK
- Pure gaming performance with smooth 100+ FPS in the world's most popular games - 6 Cores and 12 processing threads, based on AMD "Zen 4" architecture - 5.3 GHz Max Boost, unlocked for overclocking, 38 MB cache, DDR5-5200 support - AMD AM5 Socket: Supports AMD Ryzen 7000 Series Processors - DDR5 Compatible: 4*DIMMs with AMD EXPO & Intel XMP Memory Module Support - Commanding Power Design: Twin 14+2+1 Phases with 70A Power Stage Digital VRM Solution, 8-Layer 2X Copper PCB
Pattern: Bundle Style: CPU 7600X+GIGABYTE B650 AORUS ELITE AX
- Supports AMD Ryzen 7000 Series Desktop Processors - Supports DDR5 Memory, Dual Channel DDR5 7200+MHz (OC) - Enhanced Power Design: 12+2 Duet Rail Power System with P-PAK, dual 8-pin CPU power connectors, Core Boost, Memory Boost - High Quality PCB: 6-layer PCB made by 2oz thickened copper - 2.5G LAN with Wi-Fi 6E Solution: Upgraded network solution for professional and multimedia use. Delivers a secure, stable and fast network connection
Style: PRO B650-S WIFI
- Powered by the NVIDIA Blackwell architecture and DLSS 4 - SFF-Ready Enthusiast GeForce Card - TORX Fan 5.0: Fan blades linked by ring arcs work to stabilize and maintain high-pressure airflow - Nickel-plated Copper Baseplate: Heat from the GPU and memory is swiftly captured by a nickel-plated copper baseplate and transferred - Core Pipe feature a square design to maximize contact with the GPU baseplate for optimal thermal management
- 11-liter small form factor case with a sandwich design layout - Supports triple-slot GPU and clearance for 240 AIO water cooling. - Fully removable panels allows for easier access for installation and/or cable management. - Supports SFX, SFX-L Power Supply and Mini- ITX - AIO water cooling support - A DAN collaboration case
Style: A4-H2O ITX Silver
- Ideal for high speed, low power storage - Gen 4x4 NVMe PCle performance - Capacities up to 4TB
Capacity: 4TB
- 1. 120mm square anodized aluminum heatsink. (Dimension: 4.72 x 4.72 x 0.79 inch / 120x120x20mm (L*W*H)) - 2. Made from 6063-T5 aluminum alloy with high thermal conductivity, structure stability and light weight. With black oxidized surface. - 3. Particularly suitable for passive cooling of routers cooler heatsink stand such as ax3pro/ax6 ect. - 4. Can be applied for cooling of computer cabinet, for Xboxs, for Playstations, for Rokus, for TVs, receivers, modems, DVRs, computers, and other audio video electronics. - 5. Weight: 6.77 oz / 192 gr per pc.
- Chipset: AMD RX 9060 XT - Memory: 8 GB GDDR6 - XFX SWFT Dual Fan Cooling Solution - Boost Clock Up to 3320 MHz
Style: RX 9060 XT 8GB SWFT
- Superior Thermal Conductivity: KryoSheet offers exceptional thermal conductivity that surpasses traditional thermal pastes and other thermal pads. - Innovative Technology: The product harnesses the anisotropic thermal conductivity of graphite and a specially developed manufacturing technique to achieve optimal cooling performance. - Maintenance-Free: Unlike traditional thermal pastes that dry out over time, KryoSheet is maintenance-free and designed for longevity. - Wide Range of Applications: KryoSheet is suitable for enthusiast products in the consumer segment, industrial applications, and refurbishing of graphics cards and laptops. - Versatile Size Options: KryoSheet pads are available in various sizes to suit your needs, including 24 x 12 mm, 25 x 25 mm, 29 x 25 mm, 33 x 33 mm, 38 x 38 mm, 44 x 37 mm, 50 x 50 mm, 68 x 51 mm, 75 x 72 mm each 0.2 mm thick. Perfect for fitting a range of CPUs and GPUs. - Non-drying composition eliminates the need for frequent reapplication, ensuring long-term reliability. - High-end product offering superior performance compared to standard thermal pads. - Manufactured using an innovative process that enhances material properties for better heat dissipation. - SUITABLE FOR INTEL SOCKET 1851 CPUs: Ideal for use with Intel Socket 1851 processors, providing excellent thermal management for demanding applications. - COMPATIBLE WITH NVIDIA GEFORCE RTX 5090: Specifically designed to fully cover the GB202-300-A1 graphics chip, ensuring efficient cooling for high-performance GPUs.
Size: 44 x 37 x 0,2 mm
- Pure gaming performance with smooth 100+ FPS in the world's most popular games - 6 Cores and 12 processing threads, based on AMD "Zen 4" architecture - 5.3 GHz Max Boost, unlocked for overclocking, 38 MB cache, DDR5-5200 support - AMD AM5 Socket: Supports AMD Ryzen 7000 Series Processors - DDR5 Compatible: 4*DIMMs with AMD EXPO & Intel XMP Memory Module Support - Commanding Power Design: Twin 12+2+2 Phases Digital VRM Solution, 8-Layer 2X Copper PCB
Pattern: Bundle Style: CPU 7600X+GIGABYTE B650M AORUS ELITE AX
- Motherboard Compatibility – Supports Micro-ATX and Mini-ITX motherboards with a spacious interior for easy installation, improved cable management, and future upgrade flexibility. - GPU Compatibility – Supports graphics cards up to 360mm, providing ample room for high-end GPUs and next-gen performance upgrades for gaming or workstation builds. - Versatile Cooling – Equip with a 240mm liquid cooler and up to 5 case fans, ensuring strong airflow, improved heat dissipation, and stable performance during intensive gaming sessions. - Open Thermal Design – The perforated front, top, and bottom design ensures optimal thermal airflow, promoting excellent heat dissipation throughout the system. - Routing Space – With a substantial 28mm of space available behind the motherboard tray, you can effectively manage cables, resulting in a tidy and organized build.
Style: Q300L V2 Black