364 products in Components

- DDR5 - Leading the way into a new OC generation, supports Intel XMP3.0 for one-click overclocking. Compatible with Intel 600 & 700 Series Chipset - RGB colors & 120° ultra-wide lighting. Equipped with smart RGB IC controller that supports various lighting effect software. Power management ICs (PMICs) equipped for efficient power usage. - Strengthened PMIC cooling design. On-die ECC for stable system. High-Quality ICs Selected for Stability & Reliability. - Lifetime warranty. Free Technical Support and Customer Service on TEAMGROUP's official website. - Precautions: 1. Before purchasing memory products, please refer to the QVL(Qualified Vendor List) compatibility list first of the motherboard. 2. The quality of the CPU memory controller (IMC) and the version from the BIOS of motherboard may both potentially affect the operating frequency of the memory.

Size: 32GB(2x16GB)    Style: DDR5 8000MHZ 38-48-48-84    Color: White

- DDR5 - Leading the way into a new OC generation, supports Intel XMP3.0 for one-click overclocking. Compatible with Intel 600 & 700 Series Chipset - RGB colors & 120° ultra-wide lighting. Equipped with smart RGB IC controller that supports various lighting effect software. Power management ICs (PMICs) equipped for efficient power usage. - Strengthened PMIC cooling design. On-die ECC for stable system. High-Quality ICs Selected for Stability & Reliability. - Lifetime warranty. Free Technical Support and Customer Service on TEAMGROUP's official website. Refer to the latest version on the official website. In case of discrepancies, the official website prevails. - Precautions: 1. Before purchasing memory products, please refer to the QVL(Qualified Vendor List) compatibility list first of the motherboard. 2. The quality of the CPU memory controller (IMC) and the version from the BIOS of motherboard may both potentially affect the operating frequency of the memory.

Size: 32GB(2x16GB)    Style: DDR5 8000MHZ 38-48-48-84    Color: Black

- Well Packaged - With a storage box for 102pcs heatsinks, it perfectly divides the heat sinks into 17 categories. - Multiple applications - It can Cool Raspberry Pi VRM VRAM CPU GPU Small IC Laptop 3D Printers Stepper Motor Modules TMC2130 TMC2100 A4988 DRV8825 TMC2208. Multiple sizes, multiple application scenarios. - Good heat dissipation effect - Various Aluminum and Copper heat sinks with Thermal Conductive Adhesive Tape for cooling Raspberry Pi 4 and electronics components. - Different Sizes - 102pcs multicolor heatsinks in different sizes contains 92pcs aluminum heatsink and 10pcs copper heatsink. - Package Includes: 102pcs multicolor heatsinks, 1x Storage Box.

- Memory storage capacity : 64.0 GB - Compatible devices : Gaming Console - Spdif connector type : Optical - System bus standard supported : SATA 3

Style: MAG X670E TOMAHAWK WIFI

- 80 PLUS GOLD CERTIFIED - 10-year limited warranty, guaranteeing long term reliable operation - Fully modular design

Style: MAG A650GL

- Powered by NVIDIA DLSS3, ultra-efficient Ada Lovelace architecture, and full ray tracing. - 4th Generation Tensor Cores: Up to 4x performance with DLSS 3 vs. brute force rendering - OC mode: 2550 MHz / Default Mode: 2520 MHz - Axial-tech fan design features a smaller fan hub that facilitates longer blades and a barrier ring that increases downward air pressure. - A 2.55 slot design maximizes compatibility and cooling efficiency for superior performance in small chassis.

Style: Dual|White    Size: RTX4070|OC|GDDR6X

- G.SKILL Ripjaws DDR5 SO-DIMM Series DDR5 SO-DIMM Memory Kit, Model: F5-5600S4040A16GX2-RS - 32GB total capacity kit containing 2x16GB modules, rated for up to DDR5-5600 CL40-40-40-89 at 1.10V - Non-ECC, DDR5 SO-DIMM, 262-pin, for Laptop/Notebook - Includes JEDEC default profile, and Intel XMP 3.0 memory overclock profile - Do not mix memory kits. Memory kits are sold in matched kits that are designed to run together as a set. Mixing memory kits will result in stability issues or system failure. - Refer to G.SKILL memory QVL or RAM Configurator tool on the G.SKILL website for more details on validated motherboard and hardware. - Usage in any manner inconsistent with manufacturer specifications, warnings, designs, or recommendations will result in lower speeds, system instability, or damage to the system or its components. - Memory kits will boot at JEDEC default SPD speed at default BIOS settings with compatible hardware. - For memory kits with XMP and/or EXPO overclock profile, enable XMP/EXPO/DOCP/A-XMP profile in BIOS to reach up to the rated potential XMP or EXPO overclock speed of the memory kit, subject to the use of compatible hardware. Enabling XMP or EXPO is an act of overclocking and requires BIOS setting adjustments. - Reaching the rated XMP or EXPO overclock speed and system stability will depend on the compatibility and capability of the motherboard and CPU used.

Style: DDR5-5600 CL40-40-40-89

- Superior Thermal Conductivity: KryoSheet offers exceptional thermal conductivity that surpasses traditional thermal pastes and other thermal pads. - Innovative Technology: The product harnesses the anisotropic thermal conductivity of graphite and a specially developed manufacturing technique to achieve optimal cooling performance. - Maintenance-Free: Unlike traditional thermal pastes that dry out over time, KryoSheet is maintenance-free and designed for longevity. - Wide Range of Applications: KryoSheet is suitable for enthusiast products in the consumer segment, industrial applications, and refurbishing of graphics cards and laptops. - Versatile Size Options: KryoSheet pads are available in various sizes to suit your needs, including 24 x 12 mm, 25 x 25 mm, 29 x 25 mm, 33 x 33 mm, 38 x 38 mm, 44 x 37 mm, 50 x 50 mm, 68 x 51 mm, 75 x 72 mm each 0.2 mm thick. Perfect for fitting a range of CPUs and GPUs. - Non-drying composition eliminates the need for frequent reapplication, ensuring long-term reliability. - High-end product offering superior performance compared to standard thermal pads. - Manufactured using an innovative process that enhances material properties for better heat dissipation. - SUITABLE FOR INTEL SOCKET 1851 CPUs: Ideal for use with Intel Socket 1851 processors, providing excellent thermal management for demanding applications. - COMPATIBLE WITH NVIDIA GEFORCE RTX 5090: Specifically designed to fully cover the GB202-300-A1 graphics chip, ensuring efficient cooling for high-performance GPUs.

Size: 44 x 37 x 0,2 mm

- Supports AMD Ryzen 7000 Series Desktop Processors - Supports DDR5 Memory, Dual Channel DDR5 7200+MHz (OC) - Enhanced Power Design: 12+2 Duet Rail Power System with P-PAK, dual 8-pin CPU power connectors, Core Boost, Memory Boost - High Quality PCB: 6-layer PCB made by 2oz thickened copper - 2.5G LAN with Wi-Fi 6E Solution: Upgraded network solution for professional and multimedia use. Delivers a secure, stable and fast network connection

Style: PRO B650-S WIFI

- Ample Interior: Explore ample interior space for Micro-ATX or Mini-ITX motherboards, ensuring easy and future expansion - Components Clearance: Accommodates CPU coolers with a max height of 159mm, GPU cards up to 360mm, and PSU up to 160mm in length. - Versatile Cooling: Maximize cooling performance with a 240mm liquid cooler and 5 fans. - Modular I/O Panel: You have the flexibility to adjust its position at the front, top, or bottom on both sides - Edge-To-Edge Panel: Show off your meticulous build through the transparent side panel with pride. - Open Thermal Design: The perforated design on all sides promotes optimal airflow and heat dissipation - Magnetic Dust Filters: The unique pattern of the dust filter adds a distinctive appearance to the case.

Style: Q300L V1

- Motherboard Compatibility – Supports Micro-ATX and Mini-ITX motherboards with a spacious interior for easy installation, improved cable management, and future upgrade flexibility. - GPU Compatibility – Supports graphics cards up to 360mm, providing ample room for high-end GPUs and next-gen performance upgrades for gaming or workstation builds. - Versatile Cooling – Equip with a 240mm liquid cooler and up to 5 case fans, ensuring strong airflow, improved heat dissipation, and stable performance during intensive gaming sessions. - Open Thermal Design – The perforated front, top, and bottom design ensures optimal thermal airflow, promoting excellent heat dissipation throughout the system. - Routing Space – With a substantial 28mm of space available behind the motherboard tray, you can effectively manage cables, resulting in a tidy and organized build.

Style: Q300L V2    Color: Black

- Powered by the NVIDIA Blackwell architecture and DLSS 4 - SFF-Ready Enthusiast GeForce Card - TORX Fan 5.0: Fan blades linked by ring arcs work to stabilize and maintain high-pressure airflow - Nickel-plated Copper Baseplate: Heat from the GPU and memory is swiftly captured by a nickel-plated copper baseplate and transferred - Core Pipe feature a square design to maximize contact with the GPU baseplate for optimal thermal management