218 products in Components

- Pure gaming performance with smooth 100+ FPS in the world's most popular games - 6 Cores and 12 processing threads, based on AMD "Zen 4" architecture - 5.3 GHz Max Boost, unlocked for overclocking, 38 MB cache, DDR5-5200 support - AMD AM5 Socket: Supports AMD Ryzen 7000 Series Processors - DDR5 Compatible: 4*DIMMs with AMD EXPO & Intel XMP Memory Module Support - Commanding Power Design: Twin 12+2+2 Phases Digital VRM Solution, 8-Layer 2X Copper PCB

Pattern: Bundle    Style: CPU 7600X+GIGABYTE B650M AORUS ELITE AX

- Pure gaming performance with smooth 100+ FPS in the world's most popular games - 6 Cores and 12 processing threads, based on AMD "Zen 4" architecture - 5.3 GHz Max Boost, unlocked for overclocking, 38 MB cache, DDR5-5200 support - AMD AM5 Socket: Supports AMD Ryzen 7000 Series Processors - DDR5 Compatible: 4*DIMMs with AMD EXPO & Intel XMP Memory Module Support - Commanding Power Design: Twin 14+2+1 Phases with 70A Power Stage Digital VRM Solution, 8-Layer 2X Copper PCB

Pattern: Bundle    Style: CPU 7600X+GIGABYTE B650 AORUS ELITE AX

- Pure gaming performance with smooth 100+ FPS in the world's most popular games - 6 Cores and 12 processing threads, based on AMD "Zen 5" architecture - 5.4 GHz Max Boost, unlocked for overclocking, 38 MB cache, DDR5-5600 support - For the state-of-the-art Socket AM5 platform, can support PCIe 5.0 on select motherboards - Cooler not included

- Ample Interior: Explore ample interior space for Micro-ATX or Mini-ITX motherboards, ensuring easy and future expansion - Components Clearance: Accommodates CPU coolers with a max height of 159mm, GPU cards up to 360mm, and PSU up to 160mm in length. - Versatile Cooling: Maximize cooling performance with a 240mm liquid cooler and 5 fans. - Modular I/O Panel: You have the flexibility to adjust its position at the front, top, or bottom on both sides - Edge-To-Edge Panel: Show off your meticulous build through the transparent side panel with pride. - Open Thermal Design: The perforated design on all sides promotes optimal airflow and heat dissipation - Magnetic Dust Filters: The unique pattern of the dust filter adds a distinctive appearance to the case.

Style: Q300L

- Motherboard Compatibility – Supports Micro-ATX and Mini-ITX motherboards with a spacious interior for easy installation, improved cable management, and future upgrade flexibility. - GPU Compatibility – Supports graphics cards up to 360mm, providing ample room for high-end GPUs and next-gen performance upgrades for gaming or workstation builds. - Versatile Cooling – Equip with a 240mm liquid cooler and up to 5 case fans, ensuring strong airflow, improved heat dissipation, and stable performance during intensive gaming sessions. - Open Thermal Design – The perforated front, top, and bottom design ensures optimal thermal airflow, promoting excellent heat dissipation throughout the system. - Routing Space – With a substantial 28mm of space available behind the motherboard tray, you can effectively manage cables, resulting in a tidy and organized build.

Style: Q300L V2    Color: Black

- 11-liter small form factor case with a sandwich design layout - Supports triple-slot GPU and clearance for 240 AIO water cooling. - Fully removable panels allows for easier access for installation and/or cable management. - Supports SFX, SFX-L Power Supply and Mini- ITX - AIO water cooling support - A DAN collaboration case

Style: A4-H2O ITX Silver

- Compact 26.3L Design, Big Hardware Support: Accommodates mATX/ITX motherboards with 4 expansion slots and GPUs up to 415mm—achieve a compact footprint without sacrificing performance. - Stylish Wood Front Panel with Side Tempered Glass: Showcases a unique wood front panel combined with a side tempered glass panel, which enhances the overall visual impact. Side mesh panel is not included. - Supports 360mm Radiators and Up to 10 x 120mm Fans: Capable of housing a 360mm radiator and multiple 120mm fans—include a simple fan/radiator placement diagram in the images for clarity. - Flexible PSU Installation (Front/Side): Compatible with ATX/SFX/SFX-L and LIAN LI EDGE power supplies; orientation options enhance clearance and cable management.

Style: A3 (Wood Front + Glass Panel-White)

- Ideal for high speed, low power storage - Gen 4x4 NVMe PCle performance - Up to 6,000MB/s read, 5,000MB/s write - Includes Acronis cloning software - 5-year limited warranty

Capacity: 4TB

- 1. 120mm square anodized aluminum heatsink. (Dimension: 4.72 x 4.72 x 0.79 inch / 120x120x20mm (L*W*H)) - 2. Made from 6063-T5 aluminum alloy with high thermal conductivity, structure stability and light weight. With black oxidized surface. - 3. Particularly suitable for passive cooling of routers cooler heatsink stand such as ax3pro/ax6 ect. - 4. Can be applied for cooling of computer cabinet, for Xboxs, for Playstations, for Rokus, for TVs, receivers, modems, DVRs, computers, and other audio video electronics. - 5. Weight: 6.77 oz / 192 gr per pc.

- Memory Speed:18.0 Gbps.Digital Max Resolution:7680×4320 - Stream Processor: 1024 - Game Clock: 2610Mhz - Boost Clock: 2815Mhz - Memory Clock: 18.0 Gbps

Style: 6500 XT ITX

- Superior Thermal Conductivity: KryoSheet offers exceptional thermal conductivity that surpasses traditional thermal pastes and other thermal pads. - Innovative Technology: The product harnesses the anisotropic thermal conductivity of graphite and a specially developed manufacturing technique to achieve optimal cooling performance. - Maintenance-Free: Unlike traditional thermal pastes that dry out over time, KryoSheet is maintenance-free and designed for longevity. - Wide Range of Applications: KryoSheet is suitable for enthusiast products in the consumer segment, industrial applications, and refurbishing of graphics cards and laptops. - Versatile Size Options: KryoSheet pads are available in various sizes to suit your needs, including 24 x 12 mm, 25 x 25 mm, 29 x 25 mm, 33 x 33 mm, 38 x 38 mm, 44 x 37 mm, 50 x 50 mm, 68 x 51 mm, 75 x 72 mm each 0.2 mm thick. Perfect for fitting a range of CPUs and GPUs. - Non-drying composition eliminates the need for frequent reapplication, ensuring long-term reliability. - High-end product offering superior performance compared to standard thermal pads. - Manufactured using an innovative process that enhances material properties for better heat dissipation. - SUITABLE FOR INTEL SOCKET 1851 CPUs: Ideal for use with Intel Socket 1851 processors, providing excellent thermal management for demanding applications. - COMPATIBLE WITH NVIDIA GEFORCE RTX 5090: Specifically designed to fully cover the GB202-300-A1 graphics chip, ensuring efficient cooling for high-performance GPUs.

Size: 75 x 72 x 0,2 mm

- ENGINEERED FOR MAX AIRFLOW: Two 180mm and one 140mm fan included, delivering 160CFM airflow at low RPM with reduced noise for optimal CPU and GPU cooling under heavy loads. Supports up to four 180mm fans and dual 360mm/420mm radiators. - AERODYNAMIC THERMAL DESIGN: Integrated 135° angled air duct directs airflow to GPU hot zones, improving heat dissipation and ensuring stable performance. Optimised airflow layout keeps VRMs, chipset, and GPU efficiently cooled even in high-load gaming sessions. - PREMIUM SEMI-OPEN FRAME: Built with durable SGCC steel and a detachable U-shaped top fan bracket for rigidity and easier assembly. Reinforced structure improves durability and long-term reliability while allowing smooth installation of cooling hardware. - SIMPLICABLE ORGANISATION: 33mm space behind motherboard with integrated channels and Velcro straps ensures zero clutter cable runs. Flexible storage options include two vibration-dampened trays supporting either two 2.5” SSDs or one 3.5” HDD each. - NOISE-REDUCTION ENGINEERING: Vibration-dampened fan brackets, isolation mounts, and reinforced panels minimize acoustic output. Advanced HFF series fans use harmonized blade edges, Fluid Dynamic Bearings, and optimized hubs for quiet, precise, and durable airflow.

Color: White    Style: BF360 Flow